Thorben Casper

Thorben Casper

Thorben Casper, M.Sc.

+49 6151 16-24392
+49 6151 16-24027

Dolivostraße 15
64293 Darmstadt

Raum: S4|10 228

Arbeitsgebiet(e)

  • Simulation of Coupled Problems and Uncertainty Quantification in Nanoelectronics

Mehr Informationen

In the field of micro- and nanoelectronics, feature sizes are steadily shrinking, see e.g. G. E. Moore, “Cramming more components onto integrated circuits”, Electronics, vol. 38, no. 8, 1965. Power densities increase and with them the need for thermal considerations. Since resulting temperature fields may raise system failures, an electrothermal analysis is required. A common example is the failure of bond wires in microelectronic chip packages when exceeding a critical temperature.

Moreover, today’s complexity in the design and fabrication of electronic components leads to a great significance of numerical simulations. The simulation of models with large variations in component sizes requires specific numerical techniques to avoid high computational costs. Field-circuit coupling is just one of the possible methods to establish efficient models. Another field of focus is the problem of manufacturing imperfections. Not only the geometry but also the material parameters are subject to uncertainty that needs to be quantified. For the efficient calculation of failure probabilities, reduced order models are essential.

GnuPG Public Key

B439 E17D 4024 26C8 88AA  D58A 876E 183B CB8E 6C42

Publikationen

Gruppiere nach: Publikationsjahr | Typ des Eintrags | Keine Gruppierung
Springe zu: 2018 | 2017 | 2016 | 2015
Anzahl der Einträge: 22.

2018

Casper, Thorben ; Duque, David ; Schöps, Sebastian ; De Gersem, Herbert :
Electric Circuits for Exact Representations of Spatially Discretised Electrothermal and Electromagnetic 3D Field Problems.
[Online-Edition: http://maxwell-in-motion.org]
In: Workshop on Advances in Electromagnetic Research — KWT 2018, Rietzlern, Austria. Maxwell in Motion , Rietzlern, Austria
[ Konferenzveröffentlichung] , (2018)

Loukrezis, Dimitrios ; Römer, Ulrich ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert :
High Dimensional Uncertainty Quantification for an Electrothermal Field Problem using Stochastic Collocation on Sparse Grids and Tensor Train Decomposition.
[Online-Edition: https://doi.org/10.1002/jnm.2222]
In: International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, 31 (2) ISSN 1099-1204
[Artikel] , (2018)

Bigalke, Steve ; Lienig, Jens ; Casper, Thorben ; Schöps, Sebastian
Gola, Alberto (ed.) :

Increasing EM Robustness of Placement and Routing Solutions based on Layout-Driven Discretization.
[Online-Edition: https://doi.org/10.1109/PRIME.2018.8430323]
In: 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME 2018). IEEE
[Buchkapitel] , (2018)

Casper, Thorben ; Römer, Ulrich ; De Gersem, Herbert ; Schöps, Sebastian :
Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging.
In: arXiv , 1809.09034 .
[Report] , (2018) (Eingereicht)

Casper, Thorben ; Duque, David ; Schöps, Sebastian ; De Gersem, Herbert :
Automated Netlist Generation for 3D Electrothermal and Electromagnetic Field Problems.
In: arXiv , 1809.08588 .
[Report] , (2018) (Eingereicht)

2017

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian
Dyczij-Edlinger, Romanus (ed.) :

Determining Bond Wire Temperatures in Electronic Devices by a 1D-3D Coupling Approach.
[Online-Edition: https://www.kh2017.de]
In: URSI Kleinheubacher Tagung (KHB 2017), Miltenberg. Miltenberg
[ Konferenzveröffentlichung] , (2017)

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian
Schäfer, Michael (ed.) :

On the Simulation of Thin Wires in a Coupled 1D-3D Setting.
In: 4th International Conference on Computational Engineering (ICCE 2017), Darmstadt, Germany. Darmstadt, Germany
[ Konferenzveröffentlichung] , (2017)

Casper, Thorben :
1D-3D Coupling to Include Thin Wires in Electrothermal Simulations Using FIT.
[Online-Edition: http://maxwell-in-motion.org]
In: Workshop on Advances in Electromagnetic Research — KWT 2017.
[ Konferenzveröffentlichung] , (2017)

Römer, Ulrich ; Casper, Thorben ; Schöps, Sebastian :
Uncertainty Quantification for a Singular Electrothermal Coupled Problem with Error Control.
[Online-Edition: https://2017.uncecomp.org]
In: UNCECOMP 2017, Rhodes Island, Greece. Rhodes Island, Greece
[ Konferenzveröffentlichung] , (2017)

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian
Jung, Hyun-Kyo (ed.) :

An Electrothermal 1D-3D Coupling Approach for Thin Wires in Microelectronic Chip Packages.
[Online-Edition: http://www.compumag2017.com]
In: 21th Conference on the Computation of Electromagnetic Fields, Daejeon, Korea. Daejeon, Korea
[ Konferenzveröffentlichung] , (2017)

2016

Casper, Thorben ; Duque, David ; Schöps, Sebastian ; De Gersem, Herbert :
Equivalent Netlist Extraction for Electrothermal and Electromagnetic Problems Discretized by the Finite Integration Technique.
[Online-Edition: http://www.ricam.oeaw.ac.at/events/conferences/scee2016]
In: 11th Conference on Scientific Computing in Electrical Engineering (SCEE 2016).
[ Konferenzveröffentlichung] , (2016)

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian :
Determination of Bond Wire Failure Probabilities in Microelectronic Packages.
[Online-Edition: http://www.therminic2016.eu]
In: THERMINIC 2016.
[ Konferenzveröffentlichung] , (2016)

Duque, David ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert
Wasenmüller, Uwe ; Sauer-Greff, Wolfgang (eds.) :

A Circuit-Based Approach for the Solution of Electrothermal and Electromagnetic Problems.
[Online-Edition: https://www.kh2016.de]
In: URSI Kleinheubacher Tagung (KHB 2016), Miltenberg. Miltenberg
[ Konferenzveröffentlichung] , (2016)

Casper, Thorben ; De Gersem, Herbert ; Gillon, Renaud ; Gotthans, Tomas ; Kratochvíl, Tomáš ; Meuris, Peter ; Schöps, Sebastian
Fanucci, Luca ; Teich, Jürgen (eds.) :

Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
[Online-Edition: http://ieeexplore.ieee.org/document/7459510]
In: Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE). IEEE , S. 1297-1302. ISBN 978-3-9815370-6-2
[Buchkapitel] , (2016)

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian :
Efficient Evaluation of Bond Wire Fusing Probabilities.
[Online-Edition: https://www.siam.org/meetings/uq16/]
In: SIAM Conference on Uncertainty Quantification 2016.
[ Konferenzveröffentlichung] , (2016)

Casper, Thorben ; De Gersem, Herbert ; Schöps, Sebastian :
Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models.
In: EuroSimE 2016.
[ Konferenzveröffentlichung] , (2016)

Loukrezis, Dimitrios ; Römer, Ulrich ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert :
Application of High Dimensional Uncertainty Quantification Methods to Electrothermal Field Problems.
[Online-Edition: http://www.aimontefiore.org/emf2016/]
In: 10th International Symposium on Electric and Magnetic Fields (EMF 2016).
[ Konferenzveröffentlichung] , (2016)

Casper, Thorben ; De Gersem, Herbert ; Gotthans, Tomas ; Schoenmaker, Wim ; Schöps, Sebastian ; Wieers, Aarnout :
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
In: DATE 2016.
[ Konferenzveröffentlichung] , (2016)

ter Maten, E. Jan W. ; Schöps, Sebastian ; Duque, David ; Casper, Thorben ; De Gersem, Herbert ; Römer, Ulrich :
Nanoelectronic COupled problems solutions - nanoCOPS: modelling, multirate, model order reduction, uncertainty quantification, fast fault simulation.
[Online-Edition: https://dx.doi.org/10.1186/s13362-016-0025-5]
In: Journal of Mathematics in Industry, 7 (2) ISSN 2190-5983
[Artikel] , (2016)

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian :
Determination of Bond Wire Failure Probabilities in Microelectronic Packages.
[Online-Edition: https://doi.org/10.1109/THERMINIC.2016.7748645]
In: 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). , S. 39-44.
[Buchkapitel] , (2016)

Casper, Thorben ; De Gersem, Herbert ; Schöps, Sebastian :
Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models.
[Online-Edition: https://doi.org/10.1109/EuroSimE.2016.7463329]
In: 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). , S. 1-8.
[Buchkapitel] , (2016)

2015

Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert :
Electrothermal co-simulation of device structures in electronics.
In: YIC GACM 2015 — 3rd ECCOMAS Young Investigators Conference.
[ Konferenzveröffentlichung] , (2015)

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